UV Laser Cutting Machine HDZ-UVC3030

Software-controlled; User-friendly; the highly complicated task can be processed.
Mechanical or thermal stresses are avoided due to UV laser feature.
High accuracy fiducial recognition by the integrated vision system.
10-25W Laser source are optional.

Used for diverse highly complicated tasks with Circuit boards (PCBA),even variant cutting assembled PCBA, Flexible PCBA and Cover layers,etc.
Applicable for the high-quality cutting of PI, FR4, FR5 and CEM materials
Applicable for the precise processing of electronic industry like mobile phone fingerprint module, camera module, integrated chip

Category: Laser cutting

Specifications

Laser type		Fiber laser
Laser	Wavelength	355nm
	Laser power output	10W/15W
	Min. line width	0.02mm
	F-Theta lens	50 x 50 mm
	Cooling method	Water cooled
Two dimensional linear motor platform	Max.material size	400 x 300 mm
	Max. working filed size	300 x 300 mm
Control system		Scanlab galvo scanner+ control card, Windows 7
Repeat accuracy		± 0.002 mm
Final machining accuracy		± 0.02 μm
Vision System		500W pixel
Data input format		Gerber, Dxf，Plt
Dimensions		1060 x1210 x1850 mm (L x W x H)
Power supply		220V, 50/60Hz, 15A