Fiber laser Decapsulation system BL5500 series

Features

• The entire process is 100% controllable by the operator, allowing one to determine the precise depth, location, and geometry of the ablation area through our User Interface.
• Real time color vision system provides a continuous control of the ablation process.
• Three fully CNC controlled axes and two 5Mp independent high resolution Ethernet cameras ensure the precise positioning.
• Integrated red laser pointer for comfortable adjustment and positioning of the work piece.
• No destruction of wires during opening
• Laser class one safety cabinet, no additional cost for laser protection.

Application

• Semiconductor failure analysis; IC decapsulation and removing large filler mold compounds, such as revoe resin and plastics; Expose Wire Bonds