UV Laser Marking/ Engraving Machine BL9000 series

Features

• Good beam quality, extremely small focused laser spot, small heat-affected zone enabling ultra-fine marking;
• Maximum working area by using of axes, up to. 1180 x 680 mm
• Optional turntable for semi-automatic solutions. Loading/ unloading times are reduced to almost zero.
• Optional Indexing attachments for rotative markings

Application

• Widely used in LOGO marking of high-end electronic products;
• Food, PVC, medical packaging materials (HDPE, PO, PP, etc.) marking and drilling (d≤10μm);
• Flexible PCB board marking and slicing;
• Metal or non-metallic coating removing;
• Silicon wafer micro-hole and blind hole processing;
• Marking of low-voltage apparatus and refractory materials