SEMICONDUCTOR

Laser processing solutions for semiconductor

Laser technology is widely applied into the semiconductor industry, such as online/ offline PCB marking and cutting, flexible PCB marking and cutting, full-automatic IC marking and so on.

Infrared laser

Marking on discrete component

Achieved by BL3000

IC cutting

UV laser

IC cutting

Achieved by UV-Cutting

PCB cutting

UV laser

PCB cutting

Achieved by UV-Cutting

marking on PCB

UV laser

Marking on PCB

Achieved by BL-3000

FPC cutting

UV laser

FPC cutting

Achieved by UV-Cutting

Infrared laser

Marking on FPC

Achieved by BL3000

Fiber laser

Laser decapsulation

Achieved by BL5500

Semiconductors and small electronic components are usually produced in very large quantities. Economic mass production is only possible through fully automated processes. The small components often have to be provided with much information. This information must be flexibly and extremely quickly applied to the components.

By using a laser system with a galvo head for very fast deflection of the laser beam and a partially or fully automated solution, the high requirements can be met. The applied marking is resistant, durable and perfectly readable.

A laser system is also used for special test procedures of microchip testing, also called decapping.

Decapping a microchip into a process of removing the protective coating of a microchip so that the actual chip itself is revealed for visual inspection of the microcircuits. This process is typically performed to debug a manufacturing problem with the chip or possibly copy information from the chip.

Possible laser marking methods:

  1. Annealing
  2. Marking and cutting foils
  3. Colored annealing
  4. Color / anodizing and paint removal
  5. Surface structuring
  6. Marking
  7. Deep engraving
  8. 3D deep engraving
  9. Laser cutting
  10. Foaming
  11. Carbonization

Some other application examples

More applications on semiconductor industry

    • Decapping of microchips
    • Marking information and logos
    • Marking consecutive serial numbers
    • Cutting materials
    • Marking of raw materials and finished products
    • Marking of 1D & 2D codes
    • Marking of semiconductors and other electronic components / assemblies / SMD

Advantages

High efficiency is achieved by an extremely flexible laser marking system, which adapts quickly to changing requirements.

High economic efficiency, identification, traceability, quality assurance through testing with integrated camera, database connection with feedback of the labeling, high quality, durable and permanent marking, optimal and long-lasting readability.